首页> 外国专利> DC- Direct current link capacitor module with heat sink structure using the same

DC- Direct current link capacitor module with heat sink structure using the same

机译:具有散热器结构的DC-直流链路电容器模块

摘要

The present invention relates to a multilayer ceramic capacitor module and a DC-link capacitor module having a heat dissipation structure using the multilayer ceramic capacitor module, which comprises: a first terminal assembly member having a plurality of first protrusions arranged at regular intervals; A second terminal assembling member formed by arranging a plurality of second projecting members at regular intervals so as to face a plurality of first projecting members; A plurality of insulating heat radiation members supported and disposed by the first projecting member and the second projecting member, respectively; The first terminal assembling member is disposed between the insulating heat dissipating member and the plurality of insulating heat dissipating members so that one side and the other side of the first heat dissipating member are in contact with each other and one end of the second direction perpendicular to the first direction is connected to the first terminal assembling member, And a plurality of laminated ceramic capacitors whose ends are connected to the second terminal assembling member.
机译:本发明涉及一种多层陶瓷电容器模块和具有使用该多层陶瓷电容器模块的散热结构的DC链路电容器模块,该DC链路电容器模块包括:第一端子组件,其具有以规则间隔布置的多个第一突起;第二端子组装构件,通过以规则的间隔布置多个第二突出构件以面对多个第一突出构件而形成;多个绝缘散热构件分别由第一突出构件和第二突出构件支撑和设置。第一端子组装构件设置在绝缘散热构件和多个绝缘散热构件之间,使得第一散热构件的一侧和另一侧彼此接触,并且第二方向的一端垂直于第一方向连接至第一端子组装构件,多个层叠陶瓷电容器的端部连接至第二端子组装构件。

著录项

  • 公开/公告号KR101702398B1

    专利类型

  • 公开/公告日2017-02-06

    原文格式PDF

  • 申请/专利权人 삼화콘덴서공업주식회사;

    申请/专利号KR20150023308

  • 发明设计人 오영주;윤중락;유영민;

    申请日2015-02-16

  • 分类号H01G2/08;H01G4/30;H01G4/38;

  • 国家 KR

  • 入库时间 2022-08-21 13:26:06

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