The maintenance of the holding member for holding the semiconductor substrate is performed with high efficiency. A holding member managing apparatus for managing a substrate holding member for holding a semiconductor substrate in a manufacturing apparatus for manufacturing a laminated semiconductor device by bonding a plurality of semiconductor substrates, And a holding member specifying unit for specifying and outputting the identification information of the substrate holding member to be used on the basis of the use history stored in the hysteresis storage unit A management device is provided.
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