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PLASMA SOURCE AND METHOD FOR DEPOSITING THIN FILM COATINGS USING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION AND METHOD THEREOF
PLASMA SOURCE AND METHOD FOR DEPOSITING THIN FILM COATINGS USING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION AND METHOD THEREOF
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机译:等离子体源和利用等离子体增强化学气相沉积法沉积薄膜涂层的方法及其方法
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摘要
The present invention provides novel plasma sources useful in the thin film coating arts and methods of using the same. More specifically, the present invention provides novel linear and two dimensional plasma sources that produce linear and two dimensional plasmas, respectively, that are useful for plasma-enhanced chemical vapor deposition. The present invention also provides methods of making thin film coatings and methods of increasing the coating efficiencies of such methods.
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