METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM

摘要

Disclosed is a method, and associated system for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a lithographic process. The method comprises determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations (310), for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations (320), for example using an SEM or e-beam tool on product structures. A correlation is determined between said first set of parameter values (340) and said second set of parameter values and used to determine the optimized set of measurement locations (350, 360).