首页> 外国专利> METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS

METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS

机译:确定用于测量光刻工艺参数的最佳测量位置集的方法,计量系统和实施此类方法的计算机程序产品

摘要

Disclosed is a method, and associated system for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a lithographic process. The method comprises determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between said first set of parameter values and said second set of parameter values and used to determine the optimized set of measurement locations.
机译:公开了一种用于确定优化的测量位置组的方法和相关系统,所述测量位置的优化组用于测量与通过光刻工艺施加到基板的结构有关的参数。该方法包括:从跨多个第一位置的第一结构的第一测量值确定第一参数值集合,例如从目标测量值;从跨第二结构的第二结构的第二测量值确定第二参数值集合。第二多个位置,例如在产品结构上使用SEM或电子束工具。确定所述第一组参数值和所述第二组参数值之间的相关性,并将其用于确定优化的测量位置组。

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