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METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS
METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS
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机译:确定用于测量光刻工艺参数的最佳测量位置集的方法,计量系统和实施此类方法的计算机程序产品
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摘要
Disclosed is a method, and associated system for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a lithographic process. The method comprises determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between said first set of parameter values and said second set of parameter values and used to determine the optimized set of measurement locations.
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