首页> 外国专利> METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS

METHOD FOR DETERMINING AN OPTIMIZED SET OF MEASUREMENT LOCATIONS FOR MEASUREMENT OF A PARAMETER OF A LITHOGRAPHIC PROCESS, METROLOGY SYSTEM AND COMPUTER PROGRAM PRODUCTS FOR IMPLEMENTING SUCH METHODS

机译:确定用于测量光刻工艺参数的最佳测量位置集的方法,计量系统和实施此类方法的计算机程序产品

摘要

A method, and associated system, for determining an optimized set of measurement locations for measurement of a parameter related to a structure applied to a substrate by a semiconductor manufacturing process. The method includes determining a first set of parameter values from a first set of measurements of first structures across a first plurality of locations, for example from target measurements and determining a second set of parameter values from a second set of measurements of second structures across a second plurality of locations, for example using an SEM or e-beam tool on product structures. A correlation is determined between the first set of parameter values and the second set of parameter values and used to determine the optimized set of measurement locations.
机译:一种方法和相关系统,用于确定一组优化的测量位置,以测量与通过半导体制造工艺施加到基板上的结构有关的参数。该方法包括:从第一多个位置上的第一结构的第一测量值确定第一参数值集合,例如从目标测量值;从第二结构的第二结构的第二测量值确定第二参数值集合。第二多个位置,例如在产品结构上使用SEM或电子束工具。确定第一组参数值和第二组参数值之间的相关性,并将其用于确定优化的测量位置组。

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