POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONAL (3-D) INTEGRATED CIRCUIT (IC)

摘要

Systems and methods relate to power delivery networks (PDNs) for monolithic three-dimensional integrated circuits (3D-ICs). A monolithic 3D-IC includes a first die adjacent to and in contact with power/ground bumps. A second die is stacked on the first die, the second die separated from the power/ground bumps by the first die. One or more bypass power/ground vias and one or more monolithic inter-tier vias (MIVs) are configured to deliver power from the power/ground bumps to the second die.