首页> 外国专利> FRONT FACE SHAPE MEASUREMENT DEVICE MEASUREMENT PREPARATION ALIGNMENT METHOD, AND FRONT FACE SHAPE MEASUREMENT DEVICE

FRONT FACE SHAPE MEASUREMENT DEVICE MEASUREMENT PREPARATION ALIGNMENT METHOD, AND FRONT FACE SHAPE MEASUREMENT DEVICE

机译:前脸形状测量装置测量准备对准方法和前脸形状测量装置

摘要

PROBLEM TO BE SOLVED: To easily, quickly and correctly make focus adjustments, and adjustments of an angle of inclination without relying upon an operator's learning level, and provoking increase in device costs.;SOLUTION: A measurement preparation alignment method of a front surface shape measurement device detecting an interference fringe position in a Z-axis direction of each point of a measured face on the basis of an interference fringe to be acquired by an imaging unit as changing an optical path length of measurement light with which each point of the measured face is irradiated has: an intentional inclination step S10 of causing an angle of inclination of a measured face with respect to a measurement optical axis to be intentionally inclined at a preset setting angle of inclination θ2; an interference fringe retrieval step S14 of retrieving the interference fringe by the imaging unit as changing an optical path length of measurement light with which each point of the measured face inclined at the setting angle of inclination θ2 is irradiated; an interference fringe position step S16 of detecting an interference fringe position from the interference fringe obtained by the retrieval; and a focus adjustment step S20 of making adjustments so that a focus position of an optical unit focus on the detected interference fringe position.;SELECTED DRAWING: Figure 6;COPYRIGHT: (C)2018,JPO&INPIT
机译:解决的问题:在不依赖于操作者的学习水平的情况下,轻松,快速,正确地进行焦点调整和倾斜角度的调整,并且导致设备成本的增加。;解决方案:前表面形状的测量准备对准方法测量装置基于通过成像单元获取的干涉条纹来检测被测面部的每个点在Z轴方向上的干涉条纹位置,以改变被测量的每个点的测量光的光路长度照射面部具有:故意倾斜步骤S10,其使被测面部相对于测量光轴的倾斜角度有意地以预设的倾斜角度θ2倾斜。干涉条纹检索步骤S14,通过改变通过照射被测量面的每个表面以设定的倾斜角度θ2倾斜的测量光的光路长度,通过摄像单元来检索干涉条纹;干涉条纹位置步骤S16,从通过检索获得的干涉条纹中检测干涉条纹位置;聚焦调整步骤S20,进行调整,使光学单元的聚焦位置聚焦在检测到的干涉条纹位置上。SELECTED DRAWING:图6; COPYRIGHT:(C)2018,JPO&INPIT

著录项

  • 公开/公告号JP2018115988A

    专利类型

  • 公开/公告日2018-07-26

    原文格式PDF

  • 申请/专利权人 TOKYO SEIMITSU CO LTD;

    申请/专利号JP20170007742

  • 发明设计人 MORII HIDEKI;

    申请日2017-01-19

  • 分类号G01B9/02;G01B11/24;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:47

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