首页> 外国专利> GAS PIPING SYSTEM, CHEMICAL VAPOR GROWTH DEVICE, DEPOSITION METHOD AND MANUFACTURING METHOD OF SiC EPITAXIAL WAFER

GAS PIPING SYSTEM, CHEMICAL VAPOR GROWTH DEVICE, DEPOSITION METHOD AND MANUFACTURING METHOD OF SiC EPITAXIAL WAFER

机译:SiC外延片的气体配管系统,化学气相生长装置,沉积方法和制造方法

摘要

PROBLEM TO BE SOLVED: To provide a gas piping system in which clogging of piping is suppressed.SOLUTION: A gas piping system is a run-vent type gas piping system configured to supply multiple gases to a reactor in which vapor growth is performed. The gas piping system comprises: multiple supply lines for feeding the multiple gases; an exhaust line connected from an exhaust port of the reactor to an exhaust pump; a run line branched from the multiple supply lines for supplying the multiple gases to the reactor; multiple vent lines branched from the multiple supply lines and connected to the exhaust line; and multiple valves provided in the branch points of the multiple supply lines for switching whether the gases are caused to flow to the run line side or the gases are caused to flow to the vent line side. The multiple vent lines are separated until reaching the exhaust line, and an inner diameter of the exhaust line is larger than an inner diameter of each of the multiple vent lines.SELECTED DRAWING: Figure 1
机译:解决的问题:提供一种可抑制管道堵塞的气体管道系统。解决方案:气体管道系统是先运行型气体管道系统,其配置为向反应器中进行多种气体生长的反应器供应多种气体。气体管道系统包括:用于供应多种气体的多个供应管线;从反应堆的排气口连接到排气泵的排气管线;从多条供应管线分支的运行管线,用于向反应器供应多种气体;从多个供应管线分支并连接到排气管线的多个排气管线;在多个供给管线的分支点设置有多个阀,该多个阀用于切换使气体流向运行管线侧还是使气体流向排气管线侧。多个排气管线分开直到到达排气管线,并且排气管线的内径大于多个排气管线中的每一个的内径。

著录项

  • 公开/公告号JP2018006682A

    专利类型

  • 公开/公告日2018-01-11

    原文格式PDF

  • 申请/专利权人 SHOWA DENKO KK;

    申请/专利号JP20160135282

  • 申请日2016-07-07

  • 分类号H01L21/205;C23C16/42;C23C16/44;C23C16/455;C30B29/36;

  • 国家 JP

  • 入库时间 2022-08-21 13:13:35

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