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METHOD FOR EVALUATING QUALITY OF OXIDE SEMICONDUCTOR THIN FILM, METHOD FOR MANAGING QUALITY OF THE OXIDE SEMICONDUCTOR THIN FILM, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR USING THE METHOD FOR EVALUATING QUALITY
METHOD FOR EVALUATING QUALITY OF OXIDE SEMICONDUCTOR THIN FILM, METHOD FOR MANAGING QUALITY OF THE OXIDE SEMICONDUCTOR THIN FILM, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR USING THE METHOD FOR EVALUATING QUALITY
PROBLEM TO BE SOLVED: To provide a method for accurately and simply evaluating stress tolerance by predicting the energy position of a defect in a bandgap of an oxide semiconductor thin film and the defect density thereof, and also to provide a method for managing quality of an oxide semiconductor thin film on the basis of the evaluation.;SOLUTION: Among calculated values obtained by substituting, into the following formula (1), a signal value for each elapsed time after the stoppage of excitation light as measured by a μ-PCD method and the corresponding elapse time, a peak value having the highest calculated value and a time constant (μs) for the peak value are selected, and the energy position of a defect level present in an oxide semiconductor thin film and the defect density thereof are estimated from the peak value and the time constant. x=signal value×elapsed time for signal value...formula (1) (In the formula, x: calculated value; signal value: reflectivity (mV) for microwaves; and elapsed time for signal value: elapsed time (μs) from stoppage of excitation light to signal value.);SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT
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机译:解决的问题:提供一种通过预测氧化物半导体薄膜的带隙中的缺陷的能量位置及其缺陷密度来准确而简单地评估应力耐受性的方法,并提供一种用于管理应力质量的方法。解决方案:解决方案:在通过将μ-PCD方法测得的激发光停止后每个经过的时间的信号值代入下式(1)而获得的计算值中,以及相应的经过时间,选择具有最高计算值的峰值和该峰值的时间常数(μs),并估计氧化物半导体薄膜中存在的缺陷能级的能量位置及其缺陷密度从峰值和时间常数。 x =信号值×信号值的经过时间...式(1)(式中,x:计算值;信号值:微波的反射率(mV);信号值的经过时间:从以下的时间(μs)停止激励光到信号值);选定的图纸:无;版权:(C)2018,JPO&INPIT
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