FLIP-CHIP BONDING METHOD OF MICRO LED MODULE AND FLIP-CHIP BONDING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a flip-chip bonding method of micro LED module, and a flip-chip bonding module using the same.SOLUTION: A flip-chip bonding method has a step of preparing a micro LED including a substrate, and a large number of LED cells formed on an LED substrate, a step of preparing a submount substrate having a heat expansion coefficient different from that of the LED substrate, and a step of flip-chip bonding the micro LED and the submount substrate by using a solder located between the micro LED and the submount substrate. The step of flip-chip bonding controls the temperature of the submount substrate and the temperature of the LED substrate by heating-cooling curves different from each other, so as to suppress the difference of deformation volume due to the difference of heat expansion coefficient of the LED substrate and the submount substrate.SELECTED DRAWING: Figure 9