SEMICONDUCTOR DEVICE, SYSTEM-IN-PACKAGE, AND ON-VEHICLE SYSTEM-IN-PACKAGE

摘要

PROBLEM TO BE SOLVED: To suppress breaking of solder balls in a case where a high-temperature environment and a low-temperature environment are repeated.SOLUTION: A semiconductor device 10 has a semiconductor integrated circuit 20 and a substrate 11. The semiconductor integrated circuit 20 is a semiconductor chip, for example. The semiconductor integrated circuit 20 and the substrate 11 are different in thermal expansion coefficient. The substrate 11 has a plurality of solder balls 12 on an opposite surface to a surface for mounting the semiconductor integrated circuit 20. The substrate 11 has no solder ball 12 at a position corresponding to at least one side of a circumference of the semiconductor integrated circuit 20.SELECTED DRAWING: Figure 2