System-in-Package for the Next Big Thing at Device Packaging in Sunny Arizona

摘要

What is the Next Big Thing in electronics: IoT? Smarter smartphones? Autonomous driving vehicles? More important, how will our industry develop and produce the necessary systems to enable these products? These questions and more were addressed at the MAPS Global Business Council's half-day plenary session on System Integration and Package Assembly & Supply Chain Implications, held for the second year in a row as an integral part of the Device Packaging Conference in Fountain Hills, Arizona, on March 16, 2016.