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Etching solution for multilayer film, etching concentration liquid and etching method

机译:多层膜蚀刻液,蚀刻浓缩液及蚀刻方法

摘要

An etching solution for etching a multi-layer film of copper and molybdenum is provided to provide an etching liquid capable of reducing the amount of use.In the etching solution using the excess water, since the excess water is decomposed by the copper ions, a large amount of etching liquid is replenished.Hydrogen peroxideAcid organic acidAmine compoundHydrogen peroxide decomposition inhibitorAzoles andContains an anticoagulant containing aluminum saltsEthylene glycol monobutyl ether as the hydrogen peroxide decomposition inhibitor is contained at a rate of 0.4 mass% or more to 5% by mass or lessThe amine compound is nN-diethyl-1An etching solution for multilayer films characterized by 3 - propanediamineIt is possible to suppress the excess water decomposition rate even if the copper ion increases.The total amount of the etching solution can be reduced.
机译:提供用于蚀刻铜和钼的多层膜的蚀刻溶液,以提供能够减少使用量的蚀刻液。在使用过量水的蚀刻溶液中,由于过量水被铜离子分解,因此,过氧化氢酸性有机酸胺类化合物过氧化氢分解抑制剂偶氮类及含有铝盐的抗凝剂乙二醇单丁醚作为过氧化氢分解抑制剂的含量为0.4质量%以上至5%质量以下。化合物为nN-二乙基-1以3-丙二胺为特征的多层膜蚀刻液即使铜离子增加也可以抑制过量的水分解速率,可以减少蚀刻液的总量。

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