A laminate in which resin substrates are closely adhered to each other so as to be peelable from each other

摘要

PROBLEM TO BE SOLVED: To provide a laminate which can be suitably used in the production of a multilayer wiring board such as a multilayer metal-clad laminate plate and a build-up substrate.SOLUTION: This invention provides a laminate in which a release agent is interposed between two resin substrates, with the resin substrates in close contact with each other in a peelable manner.