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RESIN COMPOSITION FOR ADHERING FLUORINE RESIN SUBSTRATE AND METAL-CLAD LAMINATE OBTAINED BY USING THE RESIN COMPOSITION FOR ADHERING FLUORINE RESIN SUBSTRATE
RESIN COMPOSITION FOR ADHERING FLUORINE RESIN SUBSTRATE AND METAL-CLAD LAMINATE OBTAINED BY USING THE RESIN COMPOSITION FOR ADHERING FLUORINE RESIN SUBSTRATE
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机译:树脂组合物用于粘结氟树脂基体的树脂组合物和使用氟树脂基体粘结的金属包覆层合板
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摘要
PROBLEM TO BE SOLVED: To provide a technology prominently increasing adhesion of a fluorine resin substrate with a non-roughened metal foil by a simpler method and capable of forming fine pitch circuits.;SOLUTION: A resin composition for adhering a fluorine resin substrate, characterized by comprising 2-20 pts.wt polymer component soluble in a solvent and having one or more of hydroxy, carboxy and amino in a molecule as a functional group, and ≥50 pts.wt epoxy resin compound comprising an epoxy resin having ≥200°C boiling point and an amine-based epoxy resin curing agent having ≥200°C boiling point, is used as the resin composition for forming an adhesive layer for adhering a metal foil on a fluorine resin substrate. And, an adhesive for fluorine resin substrate and using the resin composition, a metal foil 4 with an adhesive layer in which a metal foil 2 and an adhesive layer 3 form a laminate structure, a copper-clad laminate using the fluorine resin substrate and a method for producing the laminate, are provided.;COPYRIGHT: (C)2008,JPO&INPIT
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