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Silver film forming composition, silver film, wiring board, electronic equipment and method for producing silver particles

机译:银膜形成用组合物,银膜,配线基板,电子设备及银粒子的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for producing silver particles which can easily produce high quality silver particles and thereby provide high quality silver particles, to provide a silver film-forming composition containing the same, and to provide a silver film, a wiring board, and an electronic apparatus.SOLUTION: Silver particles are produced by steps of: forming a salt by using a monocarboxylic acid and an amine compound; and adding the salt to a mixture containing silver(I) oxide. By using the silver particles, a silver film-forming composition is prepared, and by using the silver film-forming composition, a coating film is formed on a substrate, the coating film is heated to form a silver film on the substrate to produce a wiring board. Further, by using the silver film-forming composition, a coating film is formed on a transparent substrate 22 having a first detection electrode 23, a second detection electrode 24 and the like disposed thereon, the coating film is heated to form lead-out wiring 31, and a touch panel 21 is produced.
机译:解决的问题:提供一种生产银颗粒的方法,该方法可以容易地生产高质量的银颗粒,从而提供高质量的银颗粒,提供包含该银颗粒的银膜形成用组合物,并提供银膜,配线解决方案:通过以下步骤生产银颗粒:通过使用一元羧酸和一种胺化合物形成盐;然后通过以下步骤制备银颗粒。将盐加入到含有氧化银(I)的混合物中。通过使用银颗粒,制备银膜形成组合物,并且通过使用银膜形成组合物,在基板上形成涂膜,加热该涂膜以在基板上形成银膜以产生银膜。接线板。此外,通过使用形成银膜的组合物,在其上布置有第一检测电极23,第二检测电极24等的透明基板22上形成涂膜,加热该涂膜以形成引出配线。参照图31,制造触摸面板21。

著录项

  • 公开/公告号JP6287611B2

    专利类型

  • 公开/公告日2018-03-07

    原文格式PDF

  • 申请/专利权人 JSR株式会社;

    申请/专利号JP20140122913

  • 发明设计人 小林 敦;平井 剛;大喜多 健三;

    申请日2014-06-13

  • 分类号B22F9/24;B22F9/20;B22F1/00;H01B13/00;H01B1/22;H01B5/14;H05K1/09;

  • 国家 JP

  • 入库时间 2022-08-21 13:06:53

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