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Wafer Carrier, Method for Manufacturing the Same and Method for Carrying a Wafer

机译:晶圆载具,其制造方法以及晶圆载带方法

摘要

A wafer carrier comprises a first foil, a second foil, and a chamber between the first and the second foil. The first foil has a perforation and is used for carrying the wafer. The first and the second foil are connected to each other so as to form the chamber. The chamber is configured to be evacuated to form a vacuum in the chamber, the vacuum causes an underpressure at the perforation, the underpressure forms a carrying force to the wafer to be carried.
机译:晶片载体包括第一箔片,第二箔片以及在第一箔片和第二箔片之间的腔室。第一箔具有穿孔并且用于运送晶片。第一箔片和第二箔片彼此连接以形成腔室。腔室被配置为被抽成真空以在腔室中形成真空,真空在穿孔处引起负压,该负压形成对要被承载的晶片的承载力。

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