A cost effective method to analyze wafer edge structure in high volume manufacturing for 200mm wafer fabs

摘要

Significant financial profits recognized by reducing the wafer edge exclusion ring in order to increase extra productive dies as well as enhance the yield of the edge-most region of the semiconductor wafer. A method to determine distance of structure from a wafer edge is implemented using software called HandiExclusion v.3 and template named HandieRad. The wafer is put onto the template to get H degree measurement. Program then convert the H degree to a distance measurement from the wafer edge. Scanning Electron Microscope (SEM) Tap-Center Technique used to move precisely at the target distance.