首页> 外国专利> THIN-FILM PACKAGE FOR ORGANIC LIGHT-EMITTING DIODE, ORGANIC LIGHT-EMITTING DIODE, AND ORGANIC LIGHT-EMITTING DISPLAY

THIN-FILM PACKAGE FOR ORGANIC LIGHT-EMITTING DIODE, ORGANIC LIGHT-EMITTING DIODE, AND ORGANIC LIGHT-EMITTING DISPLAY

机译:用于有机发光二极管,有机发光二极管和有机发光显示器的薄膜包装

摘要

The present invention relates to a thin-film package for an organic light-emitting diode, an organic light-emitting diode using the thin-film package, and an organic light-emitting display. The thin-film package includes at least one inorganic film layer and at least one organic film layer, the inorganic film layer and the organic film layer being alternately stacked; the inorganic film layer is made of a material selected from any one of poly(silicon nitride), poly(silicon oxide), poly(silicon carbonitride), poly(silicon carbooxide), poly(silicon carbonitride) and poly(silicon carbonitrideoxide), or any combination thereof; and the organic film layer is made of a material selected from any one of acrolein-based polymer, silicon-based polymer and epoxy-based polymer, or any combination thereof. Compared with a traditional thin-film package structure, the thin-film package according to the present invention achieves a better water and oxygen resistant effect, suffers from a lower stress, and is thus suitable for use in a flexible OLED.
机译:用于有机发光二极管的薄膜封装,使用该薄膜封装的有机发光二极管以及有机发光显示器技术领域本发明涉及一种用于有机发光二极管的薄膜封装,使用该薄膜封装的有机发光二极管以及有机发光显示器。该薄膜封装件包括至少一个无机膜层和至少一个有机膜层,该无机膜层和有机膜层交替堆叠。无机膜层由选自以下的材料制成:聚氮化硅,聚氧化硅,聚碳氮化硅,聚碳氧化硅,聚碳氮化硅和聚碳氮化硅。或其任何组合;有机膜层由选自丙烯醛类聚合物,硅类聚合物和环氧类聚合物中的任一种或它们的任意组合的材料构成。与传统的薄膜封装结构相比,根据本发明的薄膜封装具有更好的耐水和氧的作用,具有较低的应力,因此适用于柔性OLED。

著录项

  • 公开/公告号US2018026232A1

    专利类型

  • 公开/公告日2018-01-25

    原文格式PDF

  • 申请/专利权人 EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED;

    申请/专利号US201715455287

  • 发明设计人 LING XIAO;

    申请日2017-03-10

  • 分类号H01L51/52;

  • 国家 US

  • 入库时间 2022-08-21 13:01:19

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