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Process Integration Techniques Using A Carbon Layer To Form Self-Aligned Structures

机译:使用碳层形成自对准结构的过程集成技术

摘要

Process integration techniques are disclosed that use a carbon fill layer during formation of self-aligned structures. A carbon layer may be placed over an etch stop layer. A cap layer may be provided over the carbon layer. The carbon layer may fill a high aspect ratio structure formed on the substrate. The carbon layer may be removed from a substrate in a highly selective removal technique in a manner that does not damage underlying layers. The carbon layer may fill a self-aligned contact region that is provided for a self-aligned contact process flow. A tone inversion mask may be used to protect multiple self-aligned contact regions. With the blocking mask in place, the carbon layer may be removed from regions that are not the self-aligned contact region. After removal of the blocking mask, the carbon layer which fills the self-aligned contacts may then be removed.
机译:公开了在自对准结构的形成过程中使用碳填充层的工艺集成技术。可以在蚀刻停止层上放置碳层。可以在碳层上方提供覆盖层。碳层可以填充形成在基板上的高纵横比结构。可以以不损坏下面的层的方式,以高度选择性的去除技术从衬底去除碳层。碳层可以填充为自对准接触工艺流程提供的自对准接触区域。音调反转掩模可以用于保护多个自对准的接触区域。在阻挡掩模就位的情况下,可以从不是自对准接触区域的区域去除碳层。在去除阻挡掩模之后,然后可以去除填充自对准触点的碳层。

著录项

  • 公开/公告号US2018308753A1

    专利类型

  • 公开/公告日2018-10-25

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US201715491786

  • 发明设计人 AELAN MOSDEN;KAUSHIK KUMAR;

    申请日2017-04-19

  • 分类号H01L21/768;H01L21/311;H01L21/28;

  • 国家 US

  • 入库时间 2022-08-21 12:59:39

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