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Array substrate and manufacturing method thereof, and a display device

机译:阵列基板及其制造方法和显示装置

摘要

An array substrate is provided. The array substrate includes a substrate body, a gate electrode layer, a first insulating layer, a source-drain electrode layer, a second insulating layer, and a transparent conducting layer, wherein the transparent conducting layer includes a bridging part. The bridging part includes a first electrode, a second electrode, and a connecting electrode, wherein a reference plane is defined perpendicular to the substrate body and passing through the first electrode, the connecting electrode, and the second electrode, and wherein a cross-sectional area of the connecting electrode that is taken perpendicular to the reference plane and taken perpendicular to the substrate body is i) smaller than a cross-sectional area of the first electrode and ii) smaller than a cross-sectional area of the second electrode.
机译:提供一种阵列基板。阵列基板包括基板主体,栅电极层,第一绝缘层,源漏电极层,第二绝缘层和透明导电层,其中,透明导电层包括桥接部分。桥接部包括第一电极,第二电极和连接电极,其中参考平面被限定为垂直于基板主体并且穿过第一电极,连接电极和第二电极,并且其中横截面垂直于参考平面且垂直于基板本体截取的连接电极的面积i)小于第一电极的截面积,并且ii)小于第二电极的截面积。

著录项

  • 公开/公告号US9818739B2

    专利类型

  • 公开/公告日2017-11-14

    原文格式PDF

  • 申请/专利权人 BOE TECHNOLOGY GROUP CO. LTD;

    申请/专利号US201615097536

  • 发明设计人 HEECHEOL KIM;

    申请日2016-04-13

  • 分类号H01L27/02;H01L27/12;H01L23/535;H01L29/786;H01L29/417;H01L29/423;

  • 国家 US

  • 入库时间 2022-08-21 12:56:43

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