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Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
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机译:具有通过线键合引线阵列的一个或多个键合以及具有一个或多个凸点互连的阵列的管芯叠层
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摘要
An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.
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