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Cleaning composition and method for cleaning semiconductor wafers after CMP
Cleaning composition and method for cleaning semiconductor wafers after CMP
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机译:CMP后的清洗组合物及清洗半导体晶片的方法
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摘要
The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.
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