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Cleaning composition and method for cleaning semiconductor wafer after CMP
Cleaning composition and method for cleaning semiconductor wafer after CMP
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机译:CMP后的清洗组合物及清洗半导体晶片的方法
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摘要
The present invention provides a composition for cleaning contaminants from semiconductor wafers after chemical mechanical polishing. The cleaning composition comprises one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The present invention also provides a method of using the cleaning composition.(FIG.
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