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Source-gate region architecture in a vertical power semiconductor device

机译:垂直功率半导体器件中的源栅区域架构

摘要

A vertical drift metal-oxide-semiconductor (VDMOS) transistor with improved contact to source and body regions, and a method of fabricating the same. A masked ion implant of the source regions into opposite-type body regions defines the locations of body contact regions, which are implanted subsequently with a blanket implant. The surface of the source regions and body contact regions are silicide clad, and an overlying insulator layer deposited and planarized. Contact openings are formed through the planarized insulator layer, within which conductive plugs are formed to contact the metal silicide, and thus the source and body regions of the device. A metal conductor is formed overall to the desired thickness, and contacts the conductive plugs to provide bias to the source and body regions.
机译:一种垂直漂移金属氧化物半导体(VDMOS)晶体管,其与源极和主体区域的接触得到改善,并且其制造方法。将源极区域掩蔽的离子注入到相反类型的身体区域中,定义了身体接触区域的位置,随后将其与毯式注入一起注入。源极区和体接触区的表面覆盖有硅化物,并且沉积并平坦化了上面的绝缘体层。穿过平坦化的绝缘体层形成接触开口,在其中形成导电塞以接触金属硅化物,从而接触器件的源极和主体区域。金属导体总体上形成为期望的厚度,并与导电塞接触以向源极和主体区域提供偏压。

著录项

  • 公开/公告号US9837358B2

    专利类型

  • 公开/公告日2017-12-05

    原文格式PDF

  • 申请/专利权人 D3 SEMICONDUCTOR LLC;

    申请/专利号US201615008997

  • 发明设计人 THOMAS E. HARRINGTON III;

    申请日2016-01-28

  • 分类号H01L23/535;H01L21/285;H01L21/768;H01L23/532;H01L29/06;H01L29/10;H01L29/66;H01L29/739;H01L29/78;

  • 国家 US

  • 入库时间 2022-08-21 12:54:21

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