METHOD OF PREPARING AN ELECTRICAL INSULATION FILM AND APPLICATION FOR THE METALLIZATION OF THROUGH-VIAS

摘要

The present invention relates essentially to a process for preparing aelectrically insulating film on the surfacea conductive or semiconductive substrate of the electricity, such as asilicon substrate. According to the invention, this process comprises :a) the contact of said surface with a liquid solution comprising :a protic solvent, at least a diazonium saat least one polymerizable monomer in the chain and soluble in said solventprotic; at least one acid in an amountsufficient to stabilize said diazonium salt by adjusting the ph ofsaid solution to a value less than 7, preferablyless than 2,5; b) the polarization of said surface in a mode potentiometer-electroplating - pulsed or for a sufficient time toform a film having a thickness of at least 60 nanometers, andpreferably, between 80 and 500 nanometers.The application: metallization of the vias, through orifices, in particular of circuitsintegrated 3d.