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DOUBLE-SIDED POLISHING DEVICE AND METHOD HAVING POLISHING PAD WITH STIFFNESS CONTROLLED BY DYNAMIC CLUSTER MAGNETIC FIELD
DOUBLE-SIDED POLISHING DEVICE AND METHOD HAVING POLISHING PAD WITH STIFFNESS CONTROLLED BY DYNAMIC CLUSTER MAGNETIC FIELD
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机译:动态团簇磁场控制刚度的双面抛光装置及方法
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摘要
A double-sided polishing device and method having a polishing pad with the stiffness controlled by a dynamic cluster magnetic field, realizing, by means of adjusting the stiffness of a flexible polishing pad, a complete process from rough polishing to finish polishing on double sides of a workpiece, and addressing the problem of conventional machining processes in which machining non-uniformity of a workpiece is caused by inconsistent relative velocities of different locations of the workpiece with respect to a polishing pad. The double-sided polishing device having a polishing pad with the stiffness controlled by a dynamic cluster magnetic field comprises: a mechanism for generating a cluster magnetic control polishing pad having stiffness variability, wherein the mechanism comprises a first magnetic field-generating block and a second magnetic field-generating block arranged symmetrically, and the first and second magnetic field-generating blocks each comprise: a casing (11), an eccentric swing main shaft (54), eccentric camshafts (51), a magnet mounting base (46), permanent magnets (47), and a motor (60); a quick workpiece-loading mechanism comprising an operation recess (10), a holding plate (41), a linking rod (45), a hinge plate (40), a hinge fixer (44), a rectangular magnet (39), a soft iron block (23), a ring-shaped cast iron member (24), and a bar-shaped permanent magnet (25); and a workpiece motion drive mechanism comprising a support block (2), a transverse beam (4), a horizontal linear motor (3), a vertical beam (22), and a vertical linear motor (7).
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