首页> 外国专利> RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A PLURALITY OF RADIATION-EMITTING SEMICONDUCTOR CHIPS, RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT

RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A PLURALITY OF RADIATION-EMITTING SEMICONDUCTOR CHIPS, RADIATION-EMITTING COMPONENT AND METHOD FOR PRODUCING A RADIATION-EMITTING COMPONENT

机译:辐射辐射半导体芯片,多种制造辐射辐射半导体芯片的方法,辐射辐射组件及辐射辐射组件的制造方法

摘要

The invention relates to a radiation-emitting semiconductor chip (10) with the following features: a semiconductor layer sequence (2) with an active layer (4) which is suitable for generating electromagnetic radiation; a substrate (11) on which the semiconductor layer sequence (2) is arranged, and which is transparent for the electromagnetic radiation generated in the active layer (4); and a reflective layer (9) which is arranged on a main surface area of the substrate (11), which is facing away from the semiconductor layer sequence (2), wherein the reflective layer (9) is made of a resin in which reflective particles are embedded. The invention also relates to a method for producing a plurality of radiation-emitting semiconductor chips (10), a radiation-emitting component and a method for producing a radiation-emitting component.
机译:本发明涉及一种具有以下特征的发射辐射的半导体芯片(10):具有用于产生电磁辐射的有源层(4)的半导体层序列(2);衬底(11),其上布置有半导体层序列(2),并且对于在有源层(4)中产生的电磁辐射是透明的;反射层(9),其布置在背对半导体层序列(2)的衬底(11)的主表面区域上,其中,反射层(9)由树脂制成,其中反射粒子被嵌入。本发明还涉及一种用于制造多个发射辐射的半导体芯片(10)的方法,一种发射辐射的部件以及一种用于制造发射辐射的部件的方法。

著录项

  • 公开/公告号WO2018019846A1

    专利类型

  • 公开/公告日2018-02-01

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号WO2017EP68791

  • 发明设计人 TÅNGRING IVAR;PERZLMAIER KORBINIAN;

    申请日2017-07-25

  • 分类号H01L33/46;H01L33;H01L33/60;H01L33/50;

  • 国家 WO

  • 入库时间 2022-08-21 12:46:11

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