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A radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor chips, radiation-emitting component and method for producing a radiation-emitting component

机译:发射辐射的半导体芯片,用于制造多个发射辐射的半导体芯片的方法,发射辐射的部件以及用于制造发射辐射的部件的方法

摘要

A radiation-emitting semiconductor chip (10) is provided with the following features: a semiconductor layer sequence (2) with an active layer (4) which is suitable for generating electromagnetic radiation, and a substrate (11) on which the semiconductor layer sequence (2) is arranged and which is transparent to the electromagnetic radiation generated in the active layer (4), - a reflective layer (9) which is arranged on a main surface of the substrate (11) facing away from the semiconductor layer sequence (2) is, wherein the reflective layer (9) is formed of a resin in which reflective particles are embedded. Furthermore, a method for producing a plurality of radiation-emitting semiconductor chips (10), a radiation-emitting component and a method for producing a radiation-emitting component are specified.
机译:发射辐射的半导体芯片(10)具有以下特征:具有适合于产生电磁辐射的有源层(4)的半导体层序列(2)以及其上具有半导体层序列的衬底(11) (2)布置成对有源层(4)中产生的电磁辐射透明;-反射层(9)布置在衬底(11)的背离半导体层序列的主表面上(如图2所示,反射层(9)由埋入有反射粒子的树脂形成。此外,提出了一种用于制造多个发射辐射的半导体芯片(10)的方法,一种发射辐射的部件以及一种用于制造发射辐射的部件的方法。

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