首页> 外国专利> Radiation-Emitting Semiconductor Chip, Method for Producing a Plurality of Radiation-Emitting Semiconductor Chips, Radiation-Emitting Component and Method for Producing a Radiation-Emitting

Radiation-Emitting Semiconductor Chip, Method for Producing a Plurality of Radiation-Emitting Semiconductor Chips, Radiation-Emitting Component and Method for Producing a Radiation-Emitting

机译:辐射发射半导体芯片,制造多个辐射发射半导体芯片的方法,发射分量和用于产生辐射发光的方法

摘要

A radiation-emitting semiconductor chip, a method for producing a plurality of radiation-emitting semiconductor chips, a radiation-emitting component and a method for producing a radiation-emitting component are disclosed. In an embodiment, a radiation-emitting semiconductor chip includes a semiconductor layer sequence having an active layer configured to generate electromagnetic radiation, a substrate on which the semiconductor layer sequence is arranged and which is transparent to the electromagnetic radiation, a reflective layer disposed on a main surface of the substrate facing away from the semiconductor layer sequence, the reflective layer including a resin in which reflective particles are embedded and a transparent resin layer located between the main surface of the substrate and the reflective layer.
机译:发光半导体芯片,一种用于制造多个辐射发射半导体芯片的方法,发光部件和用于产生辐射发射部件的方法。 在一个实施例中,发射半导体芯片包括具有被配置为产生电磁辐射的有源层的半导体层序列,其中布置半导体层序列的基板并且对电磁辐射透明,设置在a上的反射层 基板的主表面面向远离半导体层序列,反射层包括其中嵌入反射颗粒的树脂和位于基板的主表面和反射层之间的透明树脂层。

著录项

  • 公开/公告号US2021280756A1

    专利类型

  • 公开/公告日2021-09-09

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号US201716316987

  • 发明设计人 IVAR TANGRING;KORBINIAN PERZLMAIER;

    申请日2017-07-25

  • 分类号H01L33/60;H01L33/56;H01L33;

  • 国家 US

  • 入库时间 2022-08-24 20:55:49

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