首页> 外国专利> MULTI-LAYERED GRAPHENE QUANTUM CARBON-BASED SEMICONDUCTOR MATERIAL MANUFACTURED USING PI MEMBRANE AND MANUFACTURING METHOD THEREOF

MULTI-LAYERED GRAPHENE QUANTUM CARBON-BASED SEMICONDUCTOR MATERIAL MANUFACTURED USING PI MEMBRANE AND MANUFACTURING METHOD THEREOF

机译:利用pi膜制造多层石墨烯量子碳基半导体材料及其制造方法

摘要

Provided are a multi-layered graphene quantum carbon-based semiconductor material manufactured using a PI membrane, and a manufacturing method thereof. The manufacturing method comprises: S1. performing high-molecular weight sintering, using a PI membrane as the raw material, at a first temperature to remove H, O, and N atoms and form a carbon precursor; and S2. adjusting to a second temperature to perform graphitization on the carbon precursor to form a multi-layered graphene quantum carbon-based two-dimensional semiconductor material. Doping with a nanometallic material is carried out at least in step S2 to form quantum dots in the multi-layered graphene. The multi-layered graphene quantum carbon-based two-dimensional semiconductor material manufactured using the method has a molecular structure featuring a flat, hexagonal mesh. The structure has an orderly arrangement, is flexible, has a large tortuosity ratio, and extremely small intrafacial dispersion and offset. A bandgap can be formed by using nanometal doping. The bandgap can also be controlled. The manufacturing method can achieve large area, low cost, large batch, and continuous reel-to-reel production.
机译:提供使用PI膜制造的多层石墨烯量子碳基半导体材料及其制造方法。该制造方法包括:S1。以PI膜为原料,在第一温度下进行高分子量烧结,去除H,O,N原子,形成碳前驱体。和S2。调节至第二温度以对碳前体进行石墨化以形成多层石墨烯量子碳基二维半导体材料。至少在步骤S2中进行纳米金属材料的掺杂,以在多层石墨烯中形成量子点。使用该方法制造的多层石墨烯基于量子碳的二维半导体材料具有以平坦的六边形网眼为特征的分子结构。该结构排列整齐,灵活,曲折比大,界面分散和偏移极小。可以通过使用纳米金属掺杂来形成带隙。带隙也可以被控制。该制造方法可以实现大面积,低成本,大批量和连续的卷到卷生产。

著录项

  • 公开/公告号WO2018035688A1

    专利类型

  • 公开/公告日2018-03-01

    原文格式PDF

  • 申请/专利权人 SHENZHEN DANBOND TECHNOLOGY CO. LTD;

    申请/专利号WO2016CN96271

  • 发明设计人 LIU PING;

    申请日2016-08-22

  • 分类号H01L29/12;H01L29/16;H01L29/167;H01L21/324;

  • 国家 WO

  • 入库时间 2022-08-21 12:45:36

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