A low-warpage back surface aluminum paste for a crystalline silicon solar cell. The paste is prepared from the following materials in parts by mass: 85-95 parts of aluminum powder, 0.1-0.5 parts of glass powder, 4-13 parts of organic carrier and 0.6-2 parts of additive. The glass powder with large particle sizes is used for effectively lowering the coefficient of expansion of the aluminum paste. In addition, as the content of the aluminum powder in the paste formulation is high, the content of aluminum in a back surface field is thus guaranteed while the printing wet weight of the aluminum paste is reduced, thereby achieving the purpose of reducing warpage of a silicon wafer without impairing the cell performance.
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