Provided are: a curable insulating composition for printed wiring boards, which exhibits excellent dispersibility of an inorganic filler and is not susceptible to aggregation of the inorganic filler; a dry film which has a resin layer obtained from this composition; a cured product which is obtained by curing this composition or the resin layer of this dry film; a printed wiring board which comprises this cured product; and a method for producing this composition. A curable insulating composition for printed wiring boards, which contains a surface-treated inorganic filler and a curable resin, and which is characterized in that the surface-treated inorganic filler is obtained by subjecting an inorganic filler to an organic surface treatment by means of living radical polymerization; and the like. It is preferable that the surface-treated inorganic filler is obtained by subjecting an inorganic filler to a hydrophilic organic surface treatment by means of living radical polymerization and subsequently subjecting the inorganic filler to a hydrophobic organic surface treatment by means of living radical polymerization.
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