首页> 外国专利> A MEMORY CELL, AN ARRAY OF MEMORY CELLS INDIVIDUALLY COMPRISING A CAPACITOR AND A TRANSISTOR WITH THE ARRAY COMPRISING ROWS OF ACCESS LINES AND COLUMNS OF DIGIT LINES, A 2T-1C MEMORY CELL, AND METHODS OF FORMING AN ARRAY OF CAPACITORS AND ACCESS TRANSISTORS THERE-ABOVE

A MEMORY CELL, AN ARRAY OF MEMORY CELLS INDIVIDUALLY COMPRISING A CAPACITOR AND A TRANSISTOR WITH THE ARRAY COMPRISING ROWS OF ACCESS LINES AND COLUMNS OF DIGIT LINES, A 2T-1C MEMORY CELL, AND METHODS OF FORMING AN ARRAY OF CAPACITORS AND ACCESS TRANSISTORS THERE-ABOVE

机译:一个记忆细胞,一个由电容器组成的记忆细胞阵列和一个由存取线和数字行列组成的晶体管的晶体管,一个2T-1C记忆细胞以及形成电容器和存取晶体管阵列的方法以上

摘要

A method of forming an array of capacitors and access transistors there-above comprises forming access transistor trenches partially into insulative material. The trenches individually comprise longitudinally-spaced masked portions and longitudinally-spaced openings in the trenches longitudinally between the masked portions. The trench openings have walls therein extending longitudinally in and along the individual trench openings against laterally-opposing sides of the trenches. At least some of the insulative material that is under the trench openings is removed through bases of the trench openings between the walls and the masked portions to form individual capacitor openings in the insulative material that is lower than the walls. Individual capacitors are formed in the individual capacitor openings. A line of access transistors is formed in the individual trenches. The line of access transistors electrically couples to the individual capacitors that are along that line. Other aspects, including structure independent of method, are disclosed.
机译:在上面形成电容器和访问晶体管的阵列的方法包括将访问晶体管沟槽部分地形成在绝缘材料中。沟槽分别包括纵向隔开的掩蔽部分和沟槽中的纵向隔开的沟槽之间的纵向隔开的开口。沟槽开口中具有壁,该壁在各个沟槽开口中并沿着各个沟槽开口在纵向上延伸,抵靠着沟槽的横向相对的侧面。沟槽开口下方的至少一些绝缘材料通过壁和被掩盖部分之间的沟槽开口的底部被去除,以在绝缘材料中形成比壁低的单个电容器开口。在各个电容器开口中形成有各个电容器。在各个沟槽中形成存取晶体管线。存取晶体管线电耦合到沿着该线的各个电容器。公开了包括与方法无关的结构的其他方面。

著录项

  • 公开/公告号WO2018132257A1

    专利类型

  • 公开/公告日2018-07-19

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号WO2017US68425

  • 申请日2017-12-26

  • 分类号H01L27/108;H01L21/311;H01L27/11507;H01L27/11514;H01L49/02;H01L29/08;

  • 国家 WO

  • 入库时间 2022-08-21 12:43:19

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