A method for depositing a material on a substrate, a controller for controlling a material deposition process, and a device for depositing a layer on a substrate

摘要

The present disclosure relates to a method for depositing a material on a substrate, the method comprising moving a substrate (10) into a processing zone in a vacuum chamber having an array of at least three sputter cathodes (110, 120) Each of the at least three sputter cathodes 110,120 provides a plasma zone 116,126 in which a deposition is performed during the operation of at least three sputter cathodes 110,120 And the plasma zone 116, 126 is rotated once about the respective rotation axis 118, 128 from the first rotation position 140, 140 to the second rotation position 144, 144 Wherein each plasma zone 116,126 is oriented to depart from the processing zone at a first rotational position 140,140 where each plasma zone 116,126 is at a first rotational position 140,140, (140, 140), the first rotational position 2 while rotating in the rotational position (144, 144), it is moved over the processing area.