Method for depositing material on substrate, controller for controlling material deposition process, and apparatus for depositing layer on substrate

摘要

The present disclosure relates to a method for depositing material on a substrate, the method comprising moving a substrate 10 into a processing zone in a vacuum chamber having an array of at least three sputter cathodes 110, 120. Each of the at least three sputter cathodes 110, 120 provides a plasma zone 116, 126, in which plasma zones 116, 126 are deposited during operation of at least three sputter cathodes 110, 120 The material is supplied, and the plasma zones 116 and 126 are rotated only once about each axis of rotation 118 and 128 from the first rotational position 140 and 140 to the second rotational position 144 and 144. Includes a step, wherein each plasma zone 116, 126 is oriented away from the processing zone at the first rotational position 140, 140, where each plasma zone 116, 126 Moves across the processing zone while rotating from the first rotational position 140, 140 to the second rotational position 144, 144.