Jig for Manufacturing Solder Bump Bonding Method of Flip Chip and Flip Chip Manufactured by the Same

摘要

The present invention relates to a jig for manufacturing a solder bump which seals one surface of a substrate through which a via hole is formed to pass and determining a shape of a solder filled in the via hole. The jig for manufacturing a solder bump has a processing part formed in a part corresponding to the via hole to determine the shape of the solder provided in the via hole. Therefore, solder filling and processing processes can be simplified into one process.