Embodiments of the present invention generally provide methods and compositions for depositing metal-containing materials. The methods include deposition processes that form metals, metal carbides, metal suicides, metal nitrides and metal carbide derivatives by a vapor deposition process that includes pyrolysis, CVD, pulsed CVD or ALD. In one embodiment, depositing a dielectric material having a dielectric constant of greater than 10, forming feature definitions in the dielectric material, depositing a conformally work-function material on the sidewalls and bottom of the feature definition, and Depositing a metal gate fill material over the work function material to fill the feature definition,YWherein M is tantalum, hafnium, titanium and lanthanum, X is a halide selected from the group consisting of fluorine, chlorine, bromine or iodine, y is at least one metal halide precursor having the formula 3 to 5, are provided.;
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机译:本发明的实施方案通常提供用于沉积含金属的材料的方法和组合物。该方法包括通过包括热解,CVD,脉冲CVD或ALD的气相沉积过程形成金属,金属碳化物,金属硅化物,金属氮化物和金属碳化物衍生物的沉积过程。在一实施例中,沉积介电常数大于10的介电材料,在介电材料中形成特征定义,在特征定义的侧壁和底部上沉积保形功函数材料,以及在其上沉积金属栅极填充材料。填充特征定义的功函数材料, Y Sub>,其中M为钽,ha,钛和镧,X为选自氟,氯,溴或碘的卤化物,y为提供至少一种具有式3至5的金属卤化物前体。
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