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Deposition of ZrO2 and HfO2 thin films by liquid injection MOCVD and ALD using ansa-metallocene zirconium and hafnium precursors

机译:使用Ansa-茂金属锆和ha前体通过液体注入MOCVD和ALD沉积ZrO2和HfO2薄膜

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摘要

Thin films of ZrO2 and HfO2 have been deposited by liquid injection metalorganic chemical vapour deposition(MOCVD)and atomic layer deposition(ALD)using a range of ansa-metallocene precursors[(Cp2CMe2)ZrMe2](1),[(Cp2CMe2)ZrMe(OMe)](2)[(Cp2CMe2)HfMe2](3),and[(Cp2CMe2)HfMe(OMe)](4)with O2(MOCVD)or ozone(ALD)as oxygen source.The crystal structures of the new complexes 2 and 3 have been determined and they are shown to be mononuclear and isostructural to complex 1,containing a chelating[Cp2CMe2]ligand leading to a pseudo-four-coordinate distorted tetrahedral geometry around the central Zr or Hf atom,in agreement with structures from Density Functional Theory(DFT).The ZrO2 and HfO2 films were deposited by MOCVD over the temperature range 400-650°C and by ALD over the temperature range 175-350°C.X-Ray diffraction analysis showed that the HfO2 films deposited by MOCVD were amorphous,whereas the ZrO2 films deposited by MOCVD were in the tetragonal phase.Auger electron spectroscopy showed that residual carbon was present in all the films and that the films grown by MOCVD contained more carbon(2.4-17.0 at.%)than the films grown by ALD(1.8-2.8 at.%).The dielectric properties of ZrO2 and HfO2 films deposited by ALD were evaluated using[Al/MO2-Si]metal oxide semiconductor capacitor(MOSC)structures which showed that the films had low current leakage densities of less than 6 X 10~(-7)A cm~(-2)at ±2 MV cm~(-1).
机译:ZrO2和HfO2薄膜已通过液相注入金属有机化学气相沉积(MOCVD)和原子层沉积(ALD)的方法使用了一系列的ansa-茂金属前体[(Cp2CMe2)ZrMe2](1),[(Cp2CMe2)ZrMe( OMe)](2)[(Cp2CMe2)HfMe2](3)和[(Cp2CMe2)HfMe(OMe)](4),以O2(MOCVD)或臭氧(ALD)作为氧源。新配合物的晶体结构已经确定了2和3,它们显示为配合物1是单核和同构,包含螯合[Cp2CMe2]配体,导致围绕Zr或Hf原子的伪四坐标扭曲的四面体几何形状,与来自密度泛函理论(DFT)。在400-650°C的温度范围内通过MOCVD沉积ZrO2和HfO2膜,在175-350°C的温度范围内通过ALD沉积ZrO2和HfO2膜。非晶态,而MOCVD沉积的ZrO2薄膜呈四方相。俄歇电子能谱表明所有膜中都存在残余碳,并且MOCVD生长的膜比ALD生长的膜(1.8-2.8 at。%)含有更多的碳(2.4-17.0 at。%)。ZrO2和HfO2膜的介电性能用[Al / MO2 / n-Si]金属氧化物半导体电容器(MOSC)结构进行了ALD分析,结果表明该薄膜的漏电流密度小于6 X 10〜(-7)A cm〜(-2)在±2 MV cm〜(-1)

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