FCCL FILM FOR FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD LAMINATION USING SPUTTER-TYPE FCCL

摘要

The present invention relates to a film for laminating a multilayer printed circuit board using a sputter type flexible copper clad laminate (FCCL), a multilayer printed circuit board assembly including the film, and a manufacturing method of the multilayer printed circuit board. The film of the present invention has excellent adhesive strength, excellent heat resistance and flame retardancy and excellent migration resistance in laminating circuit boards by comprising an insulating adhesive layer formed by coating an insulating adhesive composition on a surface of a polyimide film of a sputter type single-sided FCCL. Therefore, the manufacturing method according to the present invention can reduce the number of films to be laminated and can simplify the manufacturing process. Further, the film according to the present invention can refine a circuit line width by using a copper foil layer as a circuit surface in the sputter type FCCL.