Selective nitride slurry with improved stability and improved polishing characteristics

摘要

(B) from about 10 ppm to about 200 ppm of a cationic polymer comprising a quaternary amino group, (c) from about 10 ppm to about 100 ppm of a cationic polymer, About 2000 ppm of a non-fluorinated nonionic surfactant, (d) an amino acid, and (e) water, and consisting essentially of or consisting of a chemical-mechanical polishing /RTI The present invention further provides a method for polishing a substrate using the polishing composition.