首页> 外国专利> Improved defect signal-to-noise due to die-to-die process noise reduction

Improved defect signal-to-noise due to die-to-die process noise reduction

机译:由于降低了芯片间的工艺噪声,改善了缺陷信噪比

摘要

The gray level histogram of the test image and the gray level histogram of the reference image are adjusted by histogram scaling. The parameters of the histogram scaling are applied to the test image and the reference image. After the parameters are applied, the reference image and the test image are compared to generate a difference image, e.g., by subtracting the reference image from the test image. The noise in the differential image can be reduced, which improves the defect identification of the differential image. In addition, a noise structure in the differential image extending in the vertical or horizontal direction can be found. If the noise exceeds a certain threshold, the structure can not be inspected.
机译:通过直方图缩放调整测试图像的灰度直方图和参考图像的灰度直方图。直方图缩放的参数应用于测试图像和参考图像。在施加参数之后,例如通过从测试图像中减去参考图像,比较参考图像和测试图像以产生差异图像。可以减少差分图像中的噪声,这改善了差分图像的缺陷识别。另外,可以发现在垂直或水平方向上延伸的差分图像中的噪声结构。如果噪音超过某个阈值,则无法检查结构。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号