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Low voltage-driven oxide phototransistors with fast recovery high signal-to-noise ratio and high responsivity fabricated via a simple defect-generating process

机译:通过简单的缺陷生成工艺制造的具有快速恢复高信噪比和高响应度的低压驱动氧化物光电晶体管

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摘要

We have demonstrated that photo-thin film transistors (photo-TFTs) fabricated via a simple defect-generating process could achieve fast recovery, a high signal to noise (S/N) ratio, and high sensitivity. The photo-TFTs are inverted-staggered bottom-gate type indium-gallium-zinc-oxide (IGZO) TFTs fabricated using atomic layer deposition (ALD)-derived Al2O3 gate insulators. The surfaces of the Al2O3 gate insulators are damaged by ion bombardment during the deposition of the IGZO channel layers by sputtering and the damage results in the hysteresis behavior of the photo-TFTs. The hysteresis loops broaden as the deposition power density increases. This implies that we can easily control the amount of the interface trap sites and/or trap sites in the gate insulator near the interface. The photo-TFTs with large hysteresis-related defects have high S/N ratio and fast recovery in spite of the low operation voltages including a drain voltage of 1 V, positive gate bias pulse voltage of 3 V, and gate voltage pulse width of 3 V (0 to 3 V). In addition, through the hysteresis-related defect-generating process, we have achieved a high responsivity since the bulk defects that can be photo-excited and eject electrons also increase with increasing deposition power density.
机译:我们已经证明,通过简单的缺陷生成工艺制造的光薄膜晶体管(photo-TFT)可以实现快速恢复,高信噪比(S / N)和高灵敏度。光电TFT是使用原子层沉积(ALD)衍生的Al2O3栅极绝缘体制造的倒交错底栅型铟镓锌氧化物(IGZO)TFT。在通过溅射沉积IGZO沟道层期间,Al 2 O 3栅极绝缘体的表面受到离子轰击的破坏,并且该破坏导致光电TFT的滞后行为。磁滞回线随着沉积功率密度的增加而变宽。这意味着我们可以轻松控制界面陷阱位点和/或靠近界面的栅极绝缘层中陷阱位点的数量。尽管具有较低的工作电压(包括1µV的漏极电压,3µV的正栅极偏置脉冲电压和3栅极电压脉冲宽度),但具有较大磁滞相关缺陷的光电TFT具有较高的S / N比和快速恢复。 V(0至3 V)。另外,通过与磁滞相关的缺陷产生过程,由于可以被光激发和喷射电子的体缺陷也随着沉积功率密度的增加而增加,因此我们实现了高响应性。

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