METHOD FOR MANUFACTURING TRANSFER FILM COMPRISING SEED LAYER METHOD FOR MANUFACTURING CIRCUIT BOARD USING SELECTIVE ETCHING OF CONDUCTIVE LAYER AND ETCHANT COMPOSITION

摘要

The present invention provides a manufacturing method of a transfer film including a seed layer capable of providing a seed layer for forming a circuit without using a copper foil film. The manufacturing method of a transfer film including a seed layer according to the present invention comprises: a seed layer forming step of forming the seed layer with a first conductive material on a carrier member; an arrangement step of arranging the seed layer on at least one surface of an insulating resin layer; a bonding step of pressing and bonding the seed layer and the insulating resin layer in the thickness direction; and a transfer step of removing the carrier member, and transferring the seed layer to the insulating resin layer.