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METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE
METHOD FOR MANUFACTURING TRANSFER FILM INCLUDING SEED LAYER, METHOD FOR MANUFACTURING CIRCUIT BOARD BY SELECTIVELY ETCHING SEED LAYER, AND ETCHING SOLUTION COMPOSITE
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机译:制造包括种子层的转移膜的方法,通过选择性地蚀刻种子层来制造电路板的方法以及蚀刻溶液组合物
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摘要
The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.
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