首页> 外国专利> Wet etching method for a single layer or multiple layer comprising Ag or Ag alloy, and etchant composition for a single layer or multiple layer comprising Ag or Ag alloy, and method for manufacturing a thin film transistor and a thin film transistor

Wet etching method for a single layer or multiple layer comprising Ag or Ag alloy, and etchant composition for a single layer or multiple layer comprising Ag or Ag alloy, and method for manufacturing a thin film transistor and a thin film transistor

机译:用于单层或多层的湿法蚀刻方法,包括Ag或Ag合金,以及用于包含Ag或Ag合金的单层或多层的蚀刻剂组合物,以及制造薄膜晶体管和薄膜晶体管的方法

摘要

The present invention relates to an etching method characterized in that etching is performed at specific longitudinal and transverse etch rates; An etching method characterized in that the etching is performed by swinging a spray nozzle for spraying the etching solution at a specific speed; and silver or a silver alloy comprising 40 to 60% by weight of phosphoric acid, 3 to 8% by weight of nitric acid, 5 to 20% by weight of acetic acid, 0.8 to 1.2% by weight of gluconic acid, and the balance of water with respect to the total weight of the composition. Or an etchant composition for a multilayer film; A method of manufacturing a thin film transistor; and a thin film transistor.
机译:本发明涉及一种蚀刻方法,其特征在于,在特定的纵向和横向蚀刻速率下进行蚀刻; 一种蚀刻方法,其特征在于,通过摆动喷嘴以以特定速度喷射蚀刻溶液来执行蚀刻的方法; 银色或银合金包含40至60重量%的磷酸,3至8重量%的硝酸,5-20重量%的乙酸,0.8-1.2重量%的葡萄糖酸,和平衡 关于组合物总重量的水。 或多层膜的蚀刻剂组合物; 一种制造薄膜晶体管的方法; 和薄膜晶体管。

著录项

  • 公开/公告号KR102344034B1

    专利类型

  • 公开/公告日2021-12-28

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020160039206

  • 发明设计人 장상훈;심경보;안기훈;

    申请日2016-03-31

  • 分类号H01L21/306;C09K13/06;C23F1/30;H01L21/3213;H01L21/4757;H01L21/67;H01L29/786;

  • 国家 KR

  • 入库时间 2022-08-24 23:05:02

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