REACTIVE SPUTTERING APPARATUS AND REACTIVE SPUTTERING METHOD

摘要

Provided is a reactive sputtering apparatus, which forms a membrane through a composition mode, a transition mode, and a metal mode using a target and a reactive gas. The reactive sputtering apparatus comprises: an inert gas inducing unit; a reactive gas inducing unit; a power supply unit for supplying electric power to the target; a detection unit for detecting plasma luminescence generated by electric power supplied to the target; and a control unit for adjusting a reactive gas flow rate in order to maintain a calculation value of plasma luminescence intensity in a wavelength or plasma luminescence intensity in a plurality of wavelengths as a predetermined value. The control unit controls the plasma luminescence intensity or the calculation value so that a ratio of cathode voltage (V) of the transition mode to cathode voltage (Vc) of the composition mode approaches a predetermined value, which is voltage detected during formation of a membrane.