METAL NANOPARTICLE PASTE ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE LED MODULE AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD

摘要

Provided is a metal nano-particle paste capable of easily obtaining a metallic junction with excellent conductivity and mechanical strength by using the low-temperature sintering property of metal nanoparticles and forming a wiring pattern excellent in continuity. (A) a metal nanoparticle, (B) a protective film for coating the surface of the metal nanoparticles, (C) carboxylic acids, and (D) a dispersion medium.