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METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD
METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD
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机译:金属纳米粒子糊,使用金属纳米粒子糊的电子组件组装,LED模块以及形成印刷线路板的电路的方法
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摘要
Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.
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